News
CLINTON, NY – Indium’s Ning-Cheng Lee, Ph.D., VP of Technology, and John H. Lau, Ph.D., CTO, Unimicron, coauthored Assembly and Reliability of Lead-Free Solder Joints.
TAIPEI – Foxconn Electronics reported consolidated revenues of NT$360.5 billion (US$12.3 billion) for June, down 9% year-over-year and 6.8% sequentially.
LYON, FRANCE – “Despite the Covid-19 outbreak, which negatively impacted the smartphone and automotive industries but spurred demand for server and PC memory for stay-at-home activities, 2020 is expected to be a year of recovery,” said Simone Bertolazzi, Ph.D., technology and market analyst, Semiconductor, Memory & Computing at Yole Développement. “At Yole, we see the beginning of a new era of prosperity for the memory industry.”
Press Releases
- Scanfil and Etteplan deepen their strategic partnership into production testing
- NOTE receives order worth 132 MSEK and expands collaboration with customer within Security & Defence
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market