News
BANNOCKBURN, IL – IPC released five revised standards covering several areas of the supply chain: IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness Assemblies; IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards; IPC-2591-Version 1.1, Connected Factory Exchange (CFX); IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements; and IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
SHANGHAI – Postponed due to Covid-19, the Productronica China and Electronica China trade shows have been rescheduled for July 3-5 here. The shows were scheduled to take place in March but were postponed due to the outbreak of the disease.
IRVINE, CA – Vision Engineering opened a 2,700 sq. ft. technology collaboration and training facility here.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing