News
SEOUL – Samsung Electronics has developed the industry’s first 12-layer 3D-TSV (through silicon via) technology, according to reports.
HERTFORDSHIRE, UK – Video conferencing hardware shipments increased 50% last year, reaching 1.4 million units, with a projected CAGR of 27% through 2022, according to Futuresource Consulting.
HERTFORDSHIRE, UK – Refined tin use is expected to slip in most sectors this year, as a result of an unstable macroeconomic environment, according to data from the International Tin Association. Refined tin use last year was 372,000 tons, up 2% from 2017.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
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- Scanfil and Etteplan deepen their strategic partnership into production testing