News
SEBERANG JAYA, MALAYSIA -- PIE Industrial is allocating more than $7 million toward an expansion of its PCB assembly operations here.
RONNEBY, SWEDEN -- Orbit One named Mattias Lindhe chief executive and COO, effective Jul. 1.
AUSTIN, TX – While Apple remains the main customer for TSMC’s integrated fan-out WLP (InFO-WLP), an increasing number of companies are adopting a large area version of FO on substrate, says TechSearch International.
Press Releases
- Kitron Strengthens Order Backlog with EUR 11 Million Contract for Defense Communication
- ZTEST Electronics Inc. Announces Transition to the OTCID Market
- SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
- Coherix Unveils Industry-First Service Program for Adhesive Dispensing Systems
POPULAR
- Editorial Contributions
- Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency
- Verifying PCBA Cleanliness with Ion Chromatography
- Factors Contributing to Solder Ball Formation: A Guide
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization