News
TAIPEI – Foxconn and IDG Capital plan to raise $1.5 billion to seed startups in automotive technologies from self-driving AI to battery development, according to published reports.
BANNOCKBURN, IL – A new report by IPC reveals cycles in demand for PCB prototypes that often differ from demand trends in regular or volume-production PCB sales.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing