News
WASHINGTON – The Department of Defense's Office of Industrial Base Policy has awarded a combined $17.5 million in contracts to support two initiatives that will strengthen the resilience of the defense microelectronics industrial base – including a project to promote production of ultra-high density interconnects for PCBs.
BANNOCKBURN, IL – North American PCB shipments in August were down 26.4% compared to the same month last year, and were down 35.7% compared to July, IPC reported in its North American Printed Circuit Board Statistical Program report.
BANNOCKBURN, IL – Total North American EMS shipments in August were up 2.49% compared to the same month last year, IPC announced in its monthly North American EMS Statistical Program report.
Press Releases
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri
- ROCKA Solutions Continues Expansion in Brazil with New Location in Manaus