News
JASPER, IN – Kimball Electronics has acquired the assets of Indianapolis-based contract manufacturer Aircom Manufacturing for an undisclosed sum.
AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.
PORTLAND, OR – The 2016 Medical Electronics Symposium will be held Sept. 14-15 at Marylhurst University.
Press Releases
- SEMI and TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
- Coherix Unveils Industry-First Service Program for Adhesive Dispensing Systems
- Hanwha Semitech Americas Appoints Jarred Ragard as Regional Sales Manager
- ASC International Expands Capabilities in Automated Optical Inspection
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