News
AUSTIN, TX – Fan-out wafer level packaging (FO-WLP) continues to show growth momentum, says TechSearch, with multiple parts found in Samsung’s Galaxy phones and many packages expected in Apple’s next iPhone. Companies are researching large area panel processing as a result of constant pressure to lower cost.
PORTLAND, OR – The 2016 Medical Electronics Symposium will be held Sept. 14-15 at Marylhurst University.
GARBSEN, GERMANY -- A new study from LPKF shows effects of changes in individual process parameters on stencil manufacturing.
Press Releases
- Syrma SGS Technology, Ltd to Accelerate AI-Driven Manufacturing with implementation of analytics and AI solution from Arch Systems in partnership with NMTronics India
- TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
- SMTA “Members of Distinction” Awards Announced
- Yamaha reveals software innovations to boost printing, mounting, and intelligent factory