News
GENT, BELGIUM -- The caretaker of the Gerber electronics data transfer format is proposing efficiency improvements for handling fabrication and assembly panels.
SAN JOSE, CA – Ahead of its acquisition of Broadcom, Avago is selling its optical module unit to Foxconn for an undisclosed sum.
LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.
Press Releases
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- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China