SINGAPORE – Scientists from Nanyang Technological University, Singapore; Panasonic Factory Solutions Asia Pacific; and Singapore Center for 3-D Printing have developed a new multi-material printer using multi-wavelength high-power lasers for quick and easy 3-D printing of smart, flexible devices.
WASHINGTON – The US Department of Commerce announced an expansion in funding opportunities for large semiconductor supply chain projects, as well as a separate process for smaller projects coming later in the year.
PIESTANY, SLOVAKIA – GPV has entered a lease agreement for a new electronics factory here in close proximity to its two existing factories in Slovakia. The additional factory is expected to start production from early 2024.