News
LYON, FRANCE – The volume of devices packaged using flip chip technology will double from 16 million wafers per year in 2014 to 32 million wafers per year in 2020, reaching $25 billion, says Yole Développement.
MONTERREY, MEXICO – Nortech Systems has launched printed circuit board assembly manufacturing at its facility here.
BANNOCKBURN, IL – North American printed circuit board orders grew 24.1% year-over-year in August, increasing year-to-date order growth to 6.2%. Orders were up 11.3% sequentially, says IPC.
Press Releases
- K&F Electronics Boosts Production with New Hanwha SMT Line
- Luminovo Appoints SaaS Veteran Clifton Lobo as VP Global Sales to Accelerate International Growth
- Johan Stormlund Joins Inspectis AB as Marketing and Sales Manager, Industrial Applications
- Altus Brings Heller’s Revolutionary Short-Cycle Vacuum Reflow Oven to the UK and Ireland