News
TAIPEI – Hon Hai (Foxconn) plans to close operations at a mobile phone facility in southern India as a result of customer changes, according to reports.
DORNSTADT, GERMANY – The 8th ASYS Group Technology Days brought some 400 customers and partner companies together to observe a full working SMT line and listen to several live electronics assembly seminars.
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
