News
TAIPEI – Foxconn is reportedly in talks with Japanese telecom and Internet firm SoftBank to produce telecom products in India.
LYON, FRANCE – Fan-in wafer-level packaging is experiencing continuous growth and attracting new applications, a new research report says, due to "indisputable benefits" linked to cost and form factor.
SAN JOSE, CA – North America-based semiconductor equipment manufacturers saw the 90-day moving average orders rise 11% year-over-year in May.
Press Releases
- NEPCON ASIA 2025: Innovating Smart Manufacturing Ecosystems and Bridging Global Opportunities
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Viasion Technology Expands Global Reach as a Trusted PCB Manufacturer and EMS Provider in China
- Nordson Test & Inspection Expands Partnership with Distributor smartTec Nordic A/S