News
TAIPEI – Hon Hai (Foxconn) plans to close operations at a mobile phone facility in southern India as a result of customer changes, according to reports.
DORNSTADT, GERMANY – The 8th ASYS Group Technology Days brought some 400 customers and partner companies together to observe a full working SMT line and listen to several live electronics assembly seminars.
AYLESBURY, UK – Nordson Dage has developed a new test method for the evaluation of die strength by means of cantilever bending, where three-point bending is not suitable for die with a thickness of fewer than 50µm.
Press Releases
- ASC International Expands Capabilities in Automated Optical Inspection
- Europlacer Expands U.S. Reach with New Eastern Region Representative
- Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
- Sierra Space Announces Opening of New “Power Station” Technology Center in Colorado as Defense Operations Grow
POPULAR
- Editorial Contributions
- Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency
- Verifying PCBA Cleanliness with Ion Chromatography
- Factors Contributing to Solder Ball Formation: A Guide
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization