News
BANNOCKBURN, IL – Electronics manufacturing services and original design manufacturers worldwide will resume growth in 2014, after a decline of approximately 4.9% percent in 2013, according to a new survey-based report by IPC.
ATLANTA – UP Media Group Inc. today named Robin Foran sales director of CIRCUITS ASSEMBLY, effective immediately.Foran comes to UPMG from Penton Media, where she was a sales executive and sold advertising and exhibition space across the US.
MINNEAPOLIS – The Best of Conference and winner of the 3D track for the International Wafer-Level Packing Conference was Jessica Fredlund, Silex Microsystems. Coauthors of her paper, “Recent Results Using Met-Via TSV Interposer Technology as TMV Element in Wafer Level Through Mold Via Packaging of CMOS Biosensors,” include Toby Ebefors, Silex Microsystems, and Erik Jung and Tanja Braun, Ph.D., Fraunhofer IZM.
Press Releases
- Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara
- Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024
- Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024
- CalcuQuote Enhances Procurement Efficiency with Texas Instruments' Backlog API Suite Integration