News
POUGHKEEPSIE, NY -- Several IBM inventors have filed a patent application for an adapter for plated through-hole mounting of surface mount components. The disclosure relates to printed circuit board assembly techniques, and more particularly, to the attachment of temperature sensitive components designed for surface mounting.
SINGAPORE – A team of scientists from the National University of Singapore has successfully developed a method to chemically exfoliate molybdenum disulfide crystals, a class of chalcogenide compounds, into high quality monolayer flakes, with higher yield and larger flake size than current methods. The exfoliated flakes can be made into a printable solution, which can be applied in printable photonics and electronics.
OXFORD, CT -- MIRTEC Corp. reported sales at its North American division rose more than 17% over 2012. “We are very pleased to announce that sales revenue for our North American Division has grown by over 17% with respect to 2012,” said president Brian D’Amico.
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