News
SANTA CLARA, CA — Industry experts will gather at a pair of conferences in November to address the mounting challenges with semiconductor multi-die integration, and known good die requirements and benefits that 2.5/3D ICs offer.
BANNOCKBURN, IL — North American printed circuit board manufacturers reported shipments fell 2.6% year-over-year in July on normal seasonality.
BANNOCKBURN, IL — Theoretical physicist, best-selling author and futurist Dr. Michio Kaku has been selected through a vote of IPC members to keynote the trade group's biggest event next spring.
Press Releases
- Dr. Jennie Hwang to deliver Professional Development Course (PDC9) on “Artificial Intelligence Era – Opportunities, Challenges, Possibilities” at SMTAI 2024 on October 21
- Indium Corporation to Highlight High-Reliability Solder Solutions at SMTA Guadalajara
- Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024
- Nordson Electronics Solutions to Feature High-Throughput Fluid Dispensing Technologies at SEMICON Taiwan 2024