News
DALLAS -- Texas Instruments today announced the shipment of nearly 6.5 billion units of copper wire bonding technology in its analog, embedded processing and wireless products.
LYON, FRANCE – Demand for mobile devices will spur MEMS devices to new highs, the latest research indicates.
HERNDON, VA – The International Electronics Manufacturing Initiative said it would host three regional workshops to review work in progress on the 2013 iNEMI Roadmap.
Meetings are scheduled in North America, Asia and Europe in May and June.
The open workshops will review select chapters, covering primarily technology and infrastructure areas. These sessions are intended to allow industry input into draft chapters to ensure inclusion of key issues from each region.
The first workshop is in San Diego May 29 (May 24 registration deadline: http://www.inemi.org/node/2231). The second is in Berlin June 12 (May 25 registration deadline: http://www.inemi.org/node/2232). The third is in Hong Kong June 14 (May 24 registration deadline: http://www.inemi.org/node/2234).
Roadmap participation is open to non-members and is free to anyone who registers before the deadline.
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