News
BANNOCKBURN, IL – IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
BANNOCKBURN, IL – The first IPC standard that originated outside the US, IPC-7527, Requirements for Solder Paste Printing, is the first standard developed that focuses on the application of solder paste.
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