News
SAN JOSE -- Ultratech has acquired the rights to a collection of patents from IBM covering fundamental patents in packaging such as C4 bumping, ball grid arrays, lead-free solders and 3D packaging.
Press Releases
- SMTA “Members of Distinction” Awards Announced
- Yamaha reveals software innovations to boost printing, mounting, and intelligent factory
- Innominds Partners with SIIX to Deliver Full-Stack ODM services for Intelligent Device-to-Cloud Solutions
- Phil Zarrow to Host SMT Bootcamp at BEST Inc. on October 15-16