News
NEWBURYPORT, MA – Rochester Electronics and BAE Systems have partnered to add more than 250,000 solutions for end-of-life semiconductors used in military and aerospace applications.
Developed from Rochester's wafer and die bank inventory, the recreated semiconductor devices are manufactured with the authorization of the original semiconductor manufacturer, and are guaranteed to be form, fit and functional replacements that match the original semiconductor's performance.
BAE provides the Advanced Component Obsolescence Management product and obsolescence management services.
The partners have produced a “decoder ring” that translates Rochester wafer and die products to finished goods manufacturing part numbers. Rochester wafer and die storage lab stores more than 10 billion die.
No financial terms were disclosed.
MUNICH -- Global demand for surface mount placement equipment remained at a high level this fall, with North America and Europe making up for persistent shortfalls in China.
FRAMINGHAM, MA – Despite the continuing global macroeconomic problems, semiconductor inventory overbuild early this year, and current DRAM oversupply, semiconductor revenues will grow 3.1% to $305 billion in 2012, according to IDC.
