News
INDIANAPOLIS – A quartet of researchers has published a new book describing the lifecycles of electronics parts and software, and explaining processes of obsolescence forecasting, and reactive, proactive, and strategic management of obsolescence.
BAKERSFIELD, CA – NuSil Technology said it is planning a large facility and expanded capabilities here.
EDINA, MN -- The SMTA seeks abstracts on a range of topics in surface mount assembly and electronics packaging for the 2013 Pan Pac Symposium.
The abstract deadline is Sept. 7. The event takes place in Maui, Hawaii.
Submit abstracts and view more info at smta.org/panpac/call_for_papers.cfm
Press Releases
- PulseForge Makes Major Breakthrough Which Allows Flux-less Soldering in an Ambient Environment
- Panasonic Connect publishes case study on delivery of its surface mount technology (SMT) equipment to Dixon Technologies, one of India’s largest EMS companies
- CE3S and Desco Industries Announce May 2026 ANSI/ESD S20.20-2021 Certification Webinar Series
- Kurtz Ersa Goes Semiconductor: Expanding Competence in Microelectronics & Advanced Packaging