News
SAN DIEGO – CIRCUITS ASSEMBLY and PRINTED CIRCUIT DESIGN & FAB magazines today announced the winners of the 2012 New Product Introduction Award for electronics assembly equipment, materials and software, and PCB fabrication.
THOUSAND OAKS, CA -- Teledyne Technologies has acquired VariSystems, a supplier of custom harsh environment interconnects. Terms of the transaction were not disclosed.
BANNOCKBURN, IL — North American printed circuit board fabricators saw shipments fall 3.5% year-over-year in January, IPC said today. Bookings rose 6.2% from a year ago.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing