News
GARDEN GROVE, CA – OK International is offering Advanced Package Rework and Repair Seminars in 2012.
The seminars will address the latest techniques to rework and repair BGAs, QFNs and micro SMDs.
The events will feature rework demonstrations with real-life applications and will include a 30-minute multimedia presentation, two hours of hands-on demonstrations and instruction, and a question and answer session.
Applications and topics include repair, rework, low-volume assembly, prototyping, screen printing for single components, flux gel deposition for BGA/CSP rework and repair, temperature profiling, and site preparation for rework and repair.
The seminar series is scheduled in the following areas:
April 10 – Northern California (Bay Area); April 25 – New England (Boston area); April 26 – NY Metro (Long Island); May 8 – Phoenix; May 22 – Guadalajara; May 22 – Chicago; May 24 – Minneapolis; June 5 – Baltimore area; June 5 – Los Angeles; June 7 – Orange County, CA; June 19 – Dallas, TX; June 21 – Austin, TX.
To register, visit http://seminars.metcal.com. The first 20 registrants will be admitted free.
STRAMBINO, ITALY – Seica SpA last week signed the final contract to acquire an industrial lot to build a facility for engineering and manufacturing activities here.
No financial terms were disclosed.
Seica SpA develops and manufactures systems and applications for testing electronic boards and modules.
The firm is celebrating its 25th anniversary.
STOCKHOLM – Mydata says its system sales increased 47% in 2011 – a record year, representing gains in market share for its entire SMT product line.
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