News
OXFORDSHIRE, ENGLAND – The Smart Area Array Reliability Conference and Table Top Exhibition will be held here Oct. 5 and 6.
Topics include industry trends on area array packaging; design and reliability of BGA and uBGA devices; soldering and joint reliability of lead-free and mixed alloys; ductility of lead-free solder balls; underfill vs. corner bumping; pad cratering on laminates; design for cleaning electronics assemblies; no-clean vs. clean; aqueous, semiaqueous and solvent choices; demonstrating area array cleaning reliability; coating and its impact of joint reliability; coating under BGA; and tin whiskers and benefits from coating.
For more information, visit www.smartgroup.org.
SHENZHEN -- Nam Tai Electronics swung to a first-quarter net profit of $2 million, up from a loss of $1.1 million in the year ago quarter.
ST. LOUIS -- Top 40 EMS firm LaBarge reported its fiscal third-quarter net profits fell 10% year-over-year to $3.7 million.
