News
KURESSAARE, ESTONIA -- Contract electronics assembler Incap will expand its factory here by some 37,000 sq. ft., almost doubling the current space.
SAO PAULO -- Huawei Technologies plans to build or buy a manufacturing plant in Brazil in the coming months, the telecom company's top local executive said yesterday.
TAIPEI -- Foxconn Electronics (the trading name of Hon Hai) today reported flat August revenues as consumer demand stagnated in anticipation of the next-generation Apple smartphones.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing