News
PARIS – Gold bumping may be the preferred attachment method for flip chip today, but that’s not going to be the case much longer, a new research report says.
BANNOCKBURN, IL – The explosion in knockoff products – reportedly a $600 billion business worldwide – has sparked group of SMT equipment manufacturers to develop an anti-counterfeit tool kit.
ARLINGTON, VA -- The Electronic Components Industry Association has updated its guidelines for reporting distributor sales information to manufacturers.
Press Releases
- ASC International Expands Capabilities in Automated Optical Inspection
- Europlacer Expands U.S. Reach with New Eastern Region Representative
- Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
- Sierra Space Announces Opening of New “Power Station” Technology Center in Colorado as Defense Operations Grow
POPULAR
- Editorial Contributions
- Smarter SMT Starts at the Reel: How Splicing Kits are Powering Efficiency
- Verifying PCBA Cleanliness with Ion Chromatography
- Factors Contributing to Solder Ball Formation: A Guide
- Systematic Troubleshooting in Electronics Assembly: A Case Study in Solder Balling and Process Optimization