News
ARUNDEL, UK -- An upcoming SMART Group workshop will look at benefits and disadvantages of ENIG, OSP, immersion silver, tin and solder leveling as finish options for printed circuit boards.
The Nov. 23 session will review performance during PCB fabrication and assembly, plus some of the common process problems. The impact on long term storage of PCBs also will be discussed. The workshop will include a tour of the Merlin/Artetch circuit board factory.
The workshop will be held Nov. 23 in Arundel. For more information: smartgroup.org/images/stories/finishesworkshop2010.pdf
SMYRNA, GA – UP Media Group Inc. seeks abstracts for the fourth annual VIRTUAL PCB, the industry’s only virtual trade show and conference for the PCB design, fabrication and assembly markets. The free two-day worldwide event takes place March 8-9, 2011.
TAIPEI – Foxconn will invest a reported $260.7 million to establish two subsidiaries and expand five existing ones in China, according to published reports.
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