ENDICOTT, NY – Endicott Interconnect Technologies and Harris Corp. have agreed to jointly develop microelectronic solutions and collaborative services for new products.
No financial terms were disclosed.
The agreement lays the framework for shared executive business reviews, program assessment, a technology roadmap and new business opportunity discussions, as well as cost reduction strategies.
Harris’ selection criteria included demonstration of EI’s AS 9100 certification and a comprehensive audit of EI processes.
BANNOCKBURN, IL – IPC has released E revisions of IPC-DRM-PTH, Through-Hole Solder Joint Evaluation Training & Reference Guide, and IPC-DRM-SMT, Surface Mount Solder Joint Evaluation Training & Reference Guide.
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