News
TAIPEI -- Foxconn Technology Group announced plans to invest up to $12 billion in new manufacturing capacity and related services in Brazil.
LYON, FRANCE -- Flip chips made up 13% of all IC packages sold in 2010, and some 29% of the global IC assembly, packaging and test market, a new research report says.
ST. LOUIS – Viasystems Group said it expects only minor impacts on the direct flow of supplies as a result of the Japan disasters; however, the possible impacts on its customers’ future order patterns are more difficult to assess.
Press Releases
- Altus Reports Growing Demand for Guidance on Convection Reflow Oven Specification
- Coherix Opens New Adhesive-Dispensing Vision Center in Europe
- Pan Pacific Strategic Electronics Symposium Program Finalized
- The Most Critical 2 Inches in SMT Manufacturing – When a Splice Fails, the Line Fails, Full Stop. Throughput and Yield Depend on One Overlooked Moment