News
FRANKLIN, MA – The US Patent Trademark Office has awarded Speedline Technologies a patent for its dual head dispensing technology.
HONG KONG -- ASM Pacific Technology has completed its acquisition of Siemens AG’s SMT placement machine unit.
NEW YORK -- API Technologies, with help from a private equity firm, will acquire fellow EMS company SenDec in an all-stock transaction.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing