News
WEST CONSHOHOCKEN, PA – Heraeus has acquired the microbond business division electronic packaging materials from Umicore AG & Co.
Heraeus has made an addition to its portfolio in the area of soft solder and flux material manufacture for use in the semiconductor industry.
Heraeus will gain 36 additional employees at its sites in Hanau, Germany and Singapore.
No financial terms were disclosed.
TORONTO – Maak Corp., a small EMS company based here, is auctioning off its equipment and assets.
WEST CONSHOHOCKEN, PA - Heraeus Materials Technology and Air-Vac Engineering have joined forces to develop solder paste for area array rework.
Development is currently underway at Heraeus’ Pennsylvania R&D center using Air-Vac’s ONYX-29 rework system.
The firms plan to optimize current dippable paste formulations specifically for the rework process. The new product is scheduled for beta testing later this year.
Air-Vac provides electronics rework equipment and processes.
Heraeus provides dippable solder pastes optimized for rework of BGAs and other area array devices.
Press Releases
- KYZEN to Feature KYZEN E5631J and AQUANOX A4618 at SMTA Michigan Expo and Tech Forum
- Semi-Kinetics Enhances Production Capabilities with New Epilog Fusion Pro Laser
- NextFlex Announces Appointment of Dr. Daniel Gamota as Incoming Executive Director to Lead Hybrid Electronics Manufacturing Institute
- AIM to Present on Micro/MiniLED Applications and Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Guadalajara Expo & Tech Forum