News
SAN JOSE – With 155 billion ICs produced, the value of the worldwide IC packaging market was $32.7 billion in 2008, reports Electronic Trend Publications.
BERLIN – The global semiconductor market is expected to decline 21.6% on an annualized basis to $194.8 billion in 2009, according to World Semiconductor Trade Statistics.
ST. PAUL, MN – SUSS MicroTec will distribute 3M’s wafer support system equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging.
Press Releases
- Stannol to Debut New Water-Based Cleaning Line at SMTA Guadalajara
- IDTechEx Explores Emerging Materials for PICs
- Transition Automation, Inc. to Exhibit Full Range of Advanced SMT Squeegees at SMTA Guadalajara
- SMTXTRA to Highlight Advanced SMT Spares, Accessories & Comprehensive Servicing Solutions at SMTA Guadalajara 2024