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MANASSAS, VA – Heraeus and Zestron recently completed an evaluation of 10 solder pastes to characterize the ability to clean flux residues on reflowed assemblies. The effort also examined each paste in its unreflowed state to identify the best methods of removal from stencils and misprinted boards.

The companies have released application bulletins for cleaning the paste formulations. 

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TAIPEI -- Foxconn Electronics (Hon Hai) reported November revenues slipped 9.1% sequentially on typical seasonality demand for consumer electronics.

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SALO, FINLAND -- Nokia plans to furlough to 400 workers through 2010 at its Salo, Finland, despite predictions of a rebound in handset sales next year. Read more ...

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