News
SANTA ANA, CA – PCB manufacturer TTM Technologies will close a pair of plants in California and lay off 347 workers because of continued weak demand in North America for PCBs and backplanes.
The firm will take charges of $11 million and $14 million as its pares its footprint and trims its workforce by 11%.
The closures to the company’s plants Los Angeles and Hayward, CA, will put 263 and 84 employees, respectively, out of work.
TTM will transfer PCB production from LA facility to other company sites in California, Utah and Wisconsin.
Backplane assembly services provided by the Hayward plant will be transferred to the company's other backplane assembly plants in Shanghai and Stafford Springs, CT.
The company expects to record between $11 million and $14 million in separation, asset impairment and disposal costs related to these closures, primarily in the third quarter of 2009.
Excluding asset impairment charges and closure costs, the firm expects to achieve its earnings and revenue guidance for the third quarter with revenue in a range of $134 million to $142 million.
BROMONT, QUEBEC – The governments of Quebec and Canada have announced a $178-million grant to the Université de Sherbrooke to establish a microelectronics innovation center.
The purpose of the project, supported by $83 million from the Canadian government and $95 million from the Quebec government, is to create a global center of excellence for research and innovation in 200-mm based MEMS and 3-D wafer level packaging, as well as advanced technologies associated with the assembly and packaging of silicon chips.
Founding partners include DALSA, IBM Canada and Université de Sherbrooke. The founding partners and various semiconductor equipment suppliers will provide support for ongoing operations.
Tortorici’s presentation will cover implantable medical devices: past successes, current status, future possibilities and challenges; Gerris will discuss a leading application for integrated 3-D systems.
The event, hosted by SMTA and MEPTEC, will take place Sept. 16-17 at Arizona State University in Tempe.
Other sessions will include market trends and forecast in medical electronics; emerging and enabling technologies; component manufacturing at the chip and packaging level; technologies that enable implantable devices; materials and design at the board and systems levels; systems manufacturing; reliability, safety and regulatory testing, and system level products and applications – external instrumentation.
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