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Productronica 2011 Products

Ecoselect 1 selective soldering system requires less than 3m² of space. Is semiautomatic; uses same technology as Versaflow system. Can handle printed circuit boards sizes up to 406 x 508mm. Includes spray monitoring and continuous pressure monitoring of the flux storage tank. Is equipped with a full-area preheater. Bottom-side heating consists of eight emitters that can be switched in groups to match their power with the assembly’s heat requirements and size. Has universal pallet conveyor; fluxer module with precision spray fluxer; bottom-side preheating via short-wave, dynamic IR emitters; top-side convection heating; Pb-free single point solder module; second solder pot to process two different solder alloys; second solder pot to process multi-up panels; camera/screen for solder process monitoring; barcode scanner; CAD data download of board layouts; operation via touch panel; traceability according to ZVEI standards, and fiducial recognition standard/option.


Ersa, www.ersa.de

FIS Track and Remote modules interface with external software systems like MES (Manufacturing Execution Software). Enable automated collection and export of programming results, to support traceability, reduce risk of recalls and minimize scrap. Provide remote control of programming commands, eliminating operator errors related to job selection and downloads, and ensuring that the correct data is programmed into the correct device on each line.

Data I/O, dataio.com

KE-3020V placement machine has a six-nozzle laser head plus a one-nozzle high-precision head with CDS sensor. Places 17,100 cph per IPC-9850; component range is 01005 to 74 x 74 mm or 50 x 150 mm; 25 mm high. Placement accuracy ±50 [U]m @3 Sigma using laser centering. Optional module processes flip-chips directly from wafers.

Juki Automation Systems, www.jas-smt.com

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