Macromelt MM6208 low-pressure molding material is for high thermal stability and chemical resistance. Has a 95°C relative temperature index rating; reportedly the highest RTI rating in its class. Uses an application pressure of between 20 and 500 psi. Is for certain automotive, consumer and appliance applications.
Henkel, www.henkel.com/electronics
Vision System Alignment provides fiducial location (used to align the PCB to the stencil in X/Y/Theta) and post-print inspection (used to detect over and under print). Uses a high-resolution 1024 x 768 pixel resolution camera system. Fiducial location function features pattern recognition to locate fiducials on the PCB and stencil. Includes multi-stage sub pixeling algorithms. 2-D Post-Print Inspection function reportedly ensures proper solder paste application to the printed circuit board with a field of view of 63 mm2 and an inspection shot rate of < 220 ms. Grayscale-based inspection detects excess solder paste and insufficient solder paste.
Milara, www.milarasmt.com
M.O.L.E. MAP 3 free software moves from separate programs to one that now supports all current ECD instrument platforms. Has nine environments: user selectable combinations of M.O.L.E. and RIDER pairing that separate one profiling data acquisition activity from another. Environments are basic profiling; WaveRider; OvenRider; OvenChecker; MiniMOLE rH; solar metallization and others.
ECD, www.ecd.com