Apex Expo 2012 Products
LabelScan handheld automated vision system can take a single image of all the fields on a supplier barcode label. Features an advanced algorithm to recognize different fields of data and transfer this data in a suitable format to any application used for receiving materials, such as an MES, MRP or ERP.
Cogiscan Inc., www.cogiscan.com
A test board for the dummy (mechanical sample) version of Amkor’s 0.3mm pitch CVBGA is available. CVBGA368-8mm Evaluation Board is for testing, evaluating and qualifying fine-pitch technology. Board size is 77 x 132mm, 1mm thick, and features four layers with 15 pads. Is offered with OSP, ImAg, and ENIG finishes. Is 8 x 8mm, 368, 0.30mm solder ball pitch, two-layer thin core substrate with an Ni/Au BGA finish that uses a HL832NX-A (60 µm core) and AUS 410 solder mask. Is identical to live package without IC die inside.
Practical Components, www.practicalcomponents.com
Ablestik ICP-3535M1 one-component, pre-mixed electrically conductive adhesive provides low and stable contact resistance when used with 100% tin-terminated components. Offers lower temperature processing, lower stress assemblies and regulatory-compliant Pb-free formulations. Attaches to a variety of substrates, including low-temperature co-fired ceramics, high-temperature ceramics, and OSP-finished printed circuit boards. Reportedly maintains stable contact resistance and good mechanical integrity after 3,000 hrs. of temperature and humidity testing, 3,000 cycles of thermal shock evaluation, and 3,000 hrs. of heat storage.
Henkel, www.henkel.com/electronics
Press Releases
- Koh Young Webinar to Show How Data Transparency Strengthens SMT Production Resilience
- Aven Welcomes Max Ramos to Strengthen Distribution Partner Operations
- ubersmt Expands SMT Line with Juki G-Titan Printer and RS-1R Placement System
- Keiron Technologies to Host LiFT Webinar Focusing on Solving Solder Paste Printing Challenges