IPC Apex Expo 2013 New Products
Fusion platform incorporates high speed DC servo drive and reduced line length. Standard cell handles PCBs up to 508 x 952mm (fluxer/preheat/solder), or for high speed applications can be configured with fluxer/preheat and up to 3 solder modules with 5 heater options. Solder cells can be configured with custom dip, multi-dip, jet-wave and single point AP down to 1.5mm. Features auto pot changer for noncontact changeover.
Pillarhouse, www.pillarhouse.biz
90iSC lead-free solder alloy is said to process much like a traditional SAC alloy but with superior temperature cycling performance, consistent with or better than conventional SnPb solders. Is a multi-component alloy based on traditional SAC but with improved temperature resistance and reliability characteristics. Has a temperature cycling range from -40° to 155°C, optimized creep resistance at high temperature, vibration and drop test performance comparable to SAC and other lead-free alloys and has printing and reflow behavior consistent with alternative lead-free materials. Is compatible with several Henkel lead-free and halogen-free flux systems.
Henkel, www.henkel.com/electronics
EKRA XACT 4 SI screen and stencil printer now comes with Simplex intuitive user interface. Is said to increase speed and ease of setup.
Asys Group, www.asys-group.com
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