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Detecting marginal joints and other solder-related defects on high-temperature thermal pads.

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Experimental data reveal a strong correlation between SPI and AXI.

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Is the slew of new materials, coatings and processes truly unique, or just the same old hype?

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A new, broad industry consortium drives for standardization across design, fabrication, assembly and test.

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A means for performing an entire production run in a single pass, using a single program, without the need to swap nozzles.

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A well-conceived program can save money and materials.

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