Circuits Assembly Online Magazine - Features

New tools are automating print and placement analysis without performance tradeoffs or retrofits.

Results of a study comparing traditional rework methods to a novel stencil process.

Perfect thermocouple placement is necessary for optimized profiles.

Test, clean energy and process control represent huge potential for EMS.

Mid-market providers are responding to OEM desires for more regional approach.

A March earthquake. September floods. Social unrest. Throughout 2011, upheaval was in the air.

Acquisitions, bankruptcies and Mother Nature were the name of the game in 2011, as topsy-turvy market conditions coupled with inexplicable environmental disasters and unprecedented social backlash led to what were in some cases previously inconceivable opportunities.