SAN JOSE –Texas Instruments VP of emerging medical applications Doug Rasor will keynote the upcoming Medical Electronics symposium: Technology Concepts Enabling Product Reality.
His talk, How Technology will Revolutionize Healthcare in the 21st Century and Beyond, will highlight the third annual MicroElectronics Packaging and Test Engineering Council event.
The event takes place Sept. 25 at Arizona State University in Tempe.
Other sessions will include Revolutionary Concepts in Medical Electronics; Advanced Materials for Medical Electronics; Key Enabling Technologies, and Next Generation of Bio-Medical Systems.
For more information and to register, contact bcooper@meptec.org or visit www.meptec.org.
His talk, How Technology will Revolutionize Healthcare in the 21st Century and Beyond, will highlight the third annual MicroElectronics Packaging and Test Engineering Council event.
The event takes place Sept. 25 at Arizona State University in Tempe.
Other sessions will include Revolutionary Concepts in Medical Electronics; Advanced Materials for Medical Electronics; Key Enabling Technologies, and Next Generation of Bio-Medical Systems.
For more information and to register, contact bcooper@meptec.org or visit www.meptec.org.
SMYRNA, GA – The PCB West 2008 two-day exhibition will be held Sept. 16 – 17 at the Santa Clara Marriott in Santa Clara, CA.
The exhibition features a sold-out show floor of 46 exhibiting companies for the PCB design industry. Exhibitors include Advanced Assembly, Applied Spectra, Dassault Systemes, Elgris Technologies, EMA Design Automation, Intercept Technology, IPC, JetPCB, National Instruments, Sigrity, Taconic, T-Tech, Valor Computerized Systems, X2y Attenuators, and others.
PCB West is for PCB engineers, designers, fabricators and managers and includes a five-day conference of more than 35 technical courses.
For more information, visit www.pcbwest.com.
TAIPEI – Compal Electronics today lowered its annual sales guidance by 9 to 13%, citing slowing US and European demand. The company, the world's second largest contract assembler of laptops, expects to ship 28 million to 29 million units this year, down from a previous forecast of 32 million. The company also forecast third-quarter shipments would grow 15% sequentially, down from earlier guidance of 20%.
BANNOCKBURN, IL – A new standard for testing and identifying the worst-case thermal process limitations for all electronic components that may be processed as part of a assembly was released today.
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, covers passives, connectors, switches and other devices. The standard was developed jointly by IPC, JEDEC and ECA (Electronic Components Association).
J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes, covers passives, connectors, switches and other devices. The standard was developed jointly by IPC, JEDEC and ECA (Electronic Components Association).
ESPOO, FINLAND – Elcoteq SE has closed on a deal to purchase Philips' flat panel TV assembly operations in Juarez, Mexico. Under terms of the deal, Elcoteq will pay $32 million in cash for certain fixed assets and inventories. The 740 local Philips personnel will become employees of Elcoteq.
WASHINGTON – While enactment of the RoHS Directive made waves, what’s been less visible is enforcement. This week, Fern Abrams, IPC’s director of government relations and environmental policy, discussed the association’s role with regard to RoHS and other looming “green” issues.
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