COOPERSVILLE, MI – Saturn Electronics & Engineering has been awarded a $500,000 federal grant to help fund new machinery and equipment at its plant here.
The company, which makes automotive electronics and components, will use the grant toward planned capital investments of some $11 million. Saturn will hire 26 additional workers as well.
The company, which makes automotive electronics and components, will use the grant toward planned capital investments of some $11 million. Saturn will hire 26 additional workers as well.
The grant is being made available by the Michigan Economic Development Corp.
SINGAPORE – Singapore's electronics industry rose in June, reversing a one-month fall into recession. The sector rose 2.3 points to 51.7, according to purchasing executives in more than 150 industrial companies.
May was the first time in nearly two years the electronics sector failed to grow.
The national purchasing managers' index rose 1.6 points sequentially to 50.6 in June, on new orders and higher levels of production output. A reading above 50.0 is a sign of an expanding market.
Electronics makes up one-third of Singapore's manufacturing output.
BANNOCKBURN, IL – North American PCB shipments rose 5.1% year-over-year in May, but orders fell 4.2%.
Through May, shipments are up 6.2%, while bookings are 7.5% higher. Compared to April, shipments were down 0.7% and bookings were down 5.2%. The book-to-bill ratio fell to 0.96.
COPENHAGEN -- Lego Group is taking its toys and going home. Europe's largest toy maker will end its outsourcing deal with Flextronics next year and bring manufacturing back in-house, the company said today.
"During the past year it has become increasingly obvious to the two parties that it would be more optimal for the Lego Group to manage its global manufacturing set up," Lego said in a statement.
"During the past year it has become increasingly obvious to the two parties that it would be more optimal for the Lego Group to manage its global manufacturing set up," Lego said in a statement.
SAN DIEGO – Pulse, an electronics component and subassembly designer and manufacturer, announced its Sonion Division will operate under the Pulse name, effective today. Sonion will undergo a name and legal entity change over the coming months.
The Technitrol Co. subsidiary’s activities related to hearing instrument components, pro-audio and medical device components will continue as a new group called MedTech. The mobile terminal components and MEMS microphone activities will become part of Pulse’s existing Wireless group.
Technitrol acquired Sonion on Feb. 28 and became part of the firm’s Electronic Components Segment.
Sonion is based in Roskilde, Denmark and has facilities in Poland, China, Vietnam, the US, and the Netherlands.
The Technitrol Co. subsidiary’s activities related to hearing instrument components, pro-audio and medical device components will continue as a new group called MedTech. The mobile terminal components and MEMS microphone activities will become part of Pulse’s existing Wireless group.
Technitrol acquired Sonion on Feb. 28 and became part of the firm’s Electronic Components Segment.
Sonion is based in Roskilde, Denmark and has facilities in Poland, China, Vietnam, the US, and the Netherlands.
SHANGHAI – Henkel and Shanghai University, along with other research universities, have entered into an agreement to form a Shanghai Region Joint Electronics Research and Failure Analysis Center.
“One-third of Henkel’s Shanghai-based 150-person research and engineering team is dedicated solely to technology development activities, and over 3% of our research and development expenditure is earmarked for cooperative efforts with universities and technology institutions,” said Dr. Horst Eierdanz, corporate vice president, Henkel R&D Engineering Adhesives.
The roadmap of the three-year project includes study of the interfacial bonding mechanisms between metals and organic polymers; new latent curing systems for advanced electronics polymer applications; fundamental studies of the rheological behavior of microelectronic assembly materials; nanocomposite microelectronic packaging materials, and advanced microelectronic thermal solutions.
The duration of the project is scheduled through March 31, 2011.
The official signing ceremony took place June 10 at Henkel Asia-Pacific and China Headquarters in Shanghai.
Press Releases
- SIA Applauds CHIPS Act Incentives for Amkor Facility in Arizona
- ASMPT and IBM Deepen Collaboration to Advance Bonding Methods for Chiplet Packages for AI
- Murray Percival Company Expands Product Line with Representation of BIMOS ESD Seating in the Midwest
- Selectronic Assembly Welcomes Eliud Herrera as Production Manager