PROVIDENCE, RI – Cookson Electronics Assembly Materials will host an Automotive Electronics Technology Day on May 23 at the ZVE Training Center in Oberpfaffenhofen, Germany.
This technical forum will include keynotes by Cookson Electronics, Seho, Siemens Corporate Technology and Lackwerke Peters, along with two Q & As.
Engineers and executives who select and specify parts and materials for automotive electronics systems assemblies, and specialty finishes for automotive parts, will debate the latest technological developments.
To register, please email cgudden@cooksonelectronics.com.
SAN JOSE, CA – With 137 billion ICs produced, the value of the worldwide IC packaging market was $27.3 billion in 2006, reports Electronic Trend Publications in its Worldwide IC Packaging Market, 2007 Edition. Growth will reportedly continue to occur through 2008, with a probable slowdown in 2009, says the researcher.
HERNDON, VA – Industry-led consortium iNEMI today announced a majority of its OEM and EMS members strongly support unique part numbers for BGA components to differentiate any Pb-free ball metallurgies other than SAC 305 or SAC 405.
Concerned about changes in metallurgies, iNEMI informs that variations can impact the manufacturing process, including form, fit and function of a device. According to members, they should be documented by the issuance of a part change notice and should be associated with a change in manufacturing part number. In this way, the manufacturing assembly process can be properly controlled prior to actual assembly to ensure reliable attachment of the BGA to the next higher assembly and to help minimize ship holds as a result of unknown parts, iNEMI says.
iNEMI members in support of this proposal include Agilent, Celestica, HP, Intel, Jabil Circuit, Microsoft, Plexus, Sanmina-SCI, Solectron and Tyco Electronics, among others.
In 2004, iNEMI called for the use of unique part numbers for RoHS-compliant components, as defined by JEDEC/IPC standards. The consortium is also calling for continued availability of SnPb BGAs for use in high-reliability products, which are currently exempt from the EU RoHS Directive. Manufacturers of these high-reliability products will continue to use SnPb processes until long-life reliability concerns regarding Pb-free are resolved, and Pb-free BGAs are not compatible with these processes, says the consortium.
ARMONK, NY – IBM this week claimed to be first to apply a self-assembling nanotechnology to conventional chip manufacturing. The company expects to have the technology ready for wide-scale use by 2009.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
The natural pattern-creating process that forms seashells, snowflakes and enamel on teeth reportedly has been harnessed to form trillions of holes to create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
The new technique to make airgaps by self-assembly skips the masking and light-etching process. Instead, IBM scientists discovered a mix of compounds they pour onto a silicon wafer with wired chip patterns before baking it.
Compounds assemble in a directed manner, creating trillions of uniform, nano-scale holes across an entire 300 mm wafer. These holes are just 20 nm in diameter, up to five times smaller than those using today’s lithography technique.
Researchers have proven electrical signals on the chips can flow 35% faster, or the chips can consume 15% less energy compared to advanced chips using conventional techniques.
The self-assembly process has been integrated with IBM's manufacturing line in East Fishkill, NY, and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM's server product lines and thereafter for chips IBM builds for other companies.
ATLANTA — Siemens Energy and Automation, Inc. this week appointed Dennis Sadlowski president and CEO. Sadlowski succeeds Aubert Martin, retiring after 40 years with Siemens.
Sadlowski started at SE&A in 2000 as a VP and GM in Atlanta. From 2003 to 2006, Sadlowski led the Siemens Automation and Drives Sensors business in Germany. In 2006, he returned to Atlanta as COO, while concurrently managing the Power Distribution & Controls Division.
BERKSHIRE, UK – A just-released NPL report describes developments using a surface insulation resistance test method to assess conformal coating protection performance on electronics assemblies.
In the report, authors Dr. Chris Hunt and L. Zou of the NPL maintain SIR is sensitive in detecting circuit reliability underneath coatings.
In the study, a test vehicle featuring a range of components was used to identify coating protection problems. The procedure on how to choose and apply contaminants to test coupons to simulate the contaminants effect from harsh environments on underlying circuit reliability is detailed, as well as the test parameter settings for SIR test and SO2 exposure testing. The method provides a measurement tool to discriminate between coatings.
The use of this method to investigate the protection performance of seven different types of coatings (two water-based acrylics, solvent-based acrylic, fluoroacrylate, silicone, polyurethane, and epoxy) against solvent-based flux, surfactant and SO2 gas, is included in the appendix.
For more information contact Hunt at chris.hunt@npl.co.uk.
In the report, authors Dr. Chris Hunt and L. Zou of the NPL maintain SIR is sensitive in detecting circuit reliability underneath coatings.
In the study, a test vehicle featuring a range of components was used to identify coating protection problems. The procedure on how to choose and apply contaminants to test coupons to simulate the contaminants effect from harsh environments on underlying circuit reliability is detailed, as well as the test parameter settings for SIR test and SO2 exposure testing. The method provides a measurement tool to discriminate between coatings.
The use of this method to investigate the protection performance of seven different types of coatings (two water-based acrylics, solvent-based acrylic, fluoroacrylate, silicone, polyurethane, and epoxy) against solvent-based flux, surfactant and SO2 gas, is included in the appendix.
For more information contact Hunt at chris.hunt@npl.co.uk.
