TEDDINGTON, UK – The upcoming Soldering Science & Technology Club meeting will take place May 24 at the National Physical Laboratory in Teddington, UK. Presentations will include Improving the Prediction of Reliability Performance of Lead-Free Assemblies; Reliability in High Frequency Vibration of Lead-Free Solder Joints; A New Technique for Reliability Assessment based on Power Cycling; Corrosion Properties of Lead-Free Alloys; Measuring the Tin-pest Transformation; Thermal Management Technology Developments in the US; Reliability of Substrates after Processing at Lead-Free Soldering Temperatures, and Will Tin Finished Components Whisker? NPL also will launch an Industry Defect Database and there will be a tabletop exhibition. This event is suited for technologists, engineers and designers, and others wishing to gain a general background in field failures. For information, contact Dr. Chris Hunt at chrishunt@npl.co.uk.
DEARBORN, MI – The Society of Manufacturing Engineers and its Electronics Manufacturing Tech Group named Professor R. Wayne Johnson winner of its 2007 Total Excellence in Electronics Manufacturing Award. The annual award recognizes extraordinary dedication and innovation in setting new or higher levels of achievement in electronics manufacturing. Johnson is a professor of electrical engineering at Auburn University and director of the Laboratory for Electronics Assembly and Packaging (LEAP). At Auburn, he has established teaching and research laboratories for advanced packaging and electronics manufacturing. His research efforts are focused on the materials, processing, and reliability aspects of electronics manufacturing. Current projects include lead-free electronics assembly, mixed lead-free and Sn/Pb electronics assembly, wafer-level packaging, flip-chip assembly, assembly of ultra thin Si die, and electronics packaging for extreme environments. He has published 52 journal papers, 135 conference papers, six book chapters and co-edited one book on electronics packaging and electronics manufacturing. Johnson holds one U.S. patent.
SAN FRANCISCO – The nation’s CIOs expect IT budgets to grow 5.1% during the next 12 months, down from 5.8% in December. The weaker results reflect increased caution across most product categories, although a rebound in large enterprise spending is expected, says Deutsche Bank Equity Research. DB’s March poll revealed a slow start to 2007, although results for very large (>5,000 employees) and small firms (101-500) strengthened in March, with CIOs expecting growth of 7% and 10%, respectively, in the next 12 months (vs. 3% and 7% in December).
COLORADO SPRINGS – IC Interconnect, a wafer bumping company, was named sole North American representative for Jiangyin Changdian Advanced Packaging, a provider of bumping technologies. The agreement establishes ICI/jcap International, the marketing, sales, engineering and customer support arm of JCAP in North America. Under the agreement IC Interconnect can install and operate its electroless nickel UBM process at a plant in China.
HIALEAH, FL -- Simclar Inc. reported fourth-quarter net income rose 394% to $949,000 on an 83.5% hike in sales to $33.2 million. The figures include the consolidated operations of Simclar and its subsidiaries, including acquisitions made during the year.
For the year ended Dec. 31, Simclar had net income of $2.9 million compared to $947,000 in 2005. Sales rose 90% to $116 million.
In a statement, chairman Sam Russell said growth has come from new and existing customers looking to consolidate their business with suppliers.
MINNEAPOLIS -- HEI Inc. today announced lower second-quarter results for the period ended March 3.
The designer and manufacturers of medical equipment systems and devices said net sales fell 10% to $10.6 million compared to the prior year. Gross profit fell by about half, to $893,000.
Net sales at the company's flexible substrate business were lower on an order drop from a primary customer looking to cut inventories. RFID orders slowed as well.
The designer and manufacturers of medical equipment systems and devices said net sales fell 10% to $10.6 million compared to the prior year. Gross profit fell by about half, to $893,000.
Net sales at the company's flexible substrate business were lower on an order drop from a primary customer looking to cut inventories. RFID orders slowed as well.
