ALAMEDA, CA -- A common theme arose during discussions at Technology Forecaster's quarterly meeting last week: knee-jerk reactions on the part of OEMs and their
manufacturing partners to the challenges of global electronics manufacturing are
not working.
Attendees reportedly expressed considerable frustration at the tactical measures they are taking to meet environmental regulations such as China RoHS and finding profitable and socially responsible ways to manufacture the low-volume, high-mix products that represent the next wave of electronics outsourcing for the global arena. "I am so tired of the fire drills for WEEE, RoHS, and now China RoHS," one OEM complained.
BRUSSELS -- An update on the status of the environmental part of TBBPA EU Risk Assessment, recently published by the European Chemicals Bureau, found that emissions of TBBPA when added to plastics can cause risks in some scenarios for surface water, sediment and soil.
No concern has been identified in practice by the risk assessment for TBBPA when used as a monomer to be reacted into the epoxy resins for the production of printed circuit board laminates. The ECB mentioned a theoretical scenario where risk reduction could operate for reactive use in cases where sewage sludge is spread to agricultural land, but there is no need for this in practice as all user sites send their industrial sludge to incineration or controlled landfills.
The update follows publication of the human health part last year in which no risks were identified.
The
environmental part of TBBPA EU Risk Assessment is expected to be finalized mid
2007.
EBFRIP believes
that most of the risks identified for additive application are manageable
through a Voluntary Emissions Control Action Programme
(VECAP)2. To date, more
than two-thirds in volumes of TBBPA additive customers in Europe have committed to control and reduce emissions.
EBFRIP will work with the UK – in charge of TBBPA Risk assessment for the EU -- which will begin draft a strategy to reduce the risks identified above.
TBBPA is used to comply with global fire safety requirements mainly as a reactive chemical in epoxy resins of printed circuit board laminates (such as FR-4, CM-1 and CM-3) and as an additive to ABS plastics
VECAP was established by
the brominated flame retardant industry, which wanted to manage, monitor and
minimise industrial emissions of commercially available brominated flame
retardants into the environment through partnership with the supply chain. Developed for deca-BDE, it
is now being applied to the main other commercial brominated flame retardants,
TBBPA and HBCD.
For a copy of the first VECAP Annual Progress Report, click here.
The new facility includes a state-of-the-art demo and training facility, comprehensive spare parts inventory, conference rooms, and increased office space to support BTU’s continuing growth in Southeast Asia.
At the opening ceremony, on Dec. 4, Boris Mathiszik, BTU’s director of sales for Asia Pacific, said, “We are very excited about our move and our resulting ability to better support our growing customer base in the region. With our branch office in Penang, Malaysia, and our Southeast Asia headquarters here in Singapore, we are able to provide our customers unmatched service and support capability.”
The new office address is:
BTU Overseas, Ltd
No. 9 Kaki Bukit Road 1
#02-10 Eunos Technolink
Singapore 415938
Tel : 65-67414567
The show will take place the week of September 24, 2007, in Schaumburg, IL, a Chicago suburb. It is backed by the SMEMA Council, a group of major assembly equipment OEMs and an adjunct of IPC. The official name of the show is the IPC Midwest Conference & Exhibition, although some are casually referring to it as Apex Midwest.
