ST. LOUIS—LaBarge has signed a multiyear agreement with Eclipse Aviation Corp. to provide wiring harnesses for the Eclipse 500, a new aircraft known as a very light jet (VLJ). Initial orders total approximately $10 million.
LaBarge will build more than 80 different complex wiring harnesses that function in electronic systems related to fuel monitoring, landing gear, engine and cockpit functionality. Production is beginning immediately at LaBarge’s Berryville, AK, and Joplin, MO, facilities and is expected to continue through mid-2007.
Eclipse Aviation has said that the Eclipse 500 is on track to receive Federal Aviation Administration certification in late second quarter of 2006 and to begin customer deliveries shortly thereafter. To date, Eclipse has received orders for more than 2,400 Eclipse 500s.
LaBarge will build more than 80 different complex wiring harnesses that function in electronic systems related to fuel monitoring, landing gear, engine and cockpit functionality. Production is beginning immediately at LaBarge’s Berryville, AK, and Joplin, MO, facilities and is expected to continue through mid-2007.
Eclipse Aviation has said that the Eclipse 500 is on track to receive Federal Aviation Administration certification in late second quarter of 2006 and to begin customer deliveries shortly thereafter. To date, Eclipse has received orders for more than 2,400 Eclipse 500s.
HERNDON, VA and PISCATAWAY, NJ —The International Electronics Manufacturing Initiative (iNEMI), will co-sponsor the third annual Tin Whisker Workshop with the IEEE Components, Packaging and Manufacturing Technology Society (CPMT) and the Electronic Components and Technology Conference (ECTC). The workshop is scheduled for May 30, at ECTC in San Diego.
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
For additional info, visit: inemi.org/cms/calendar/06_ECTC_TW_Workshop.html
The workshop will provide an update on recent activities in the testing and modeling of tin whiskers. A roundtable discussion will focus on implementation of the JEDEC/IPC specifications relating to tin whiskers: JESD201, “Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finishes;” JEDEC/IPC joint publication JP002, “Current Tin Whiskers Theory and Mitigation Practices Guideline;” and JESD22A121, “Test Method for Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes.” The workshop aims to identify strategies to assure that long lifecycle applications will not be subject to tin whisker failures.
For additional info, visit: inemi.org/cms/calendar/06_ECTC_TW_Workshop.html
ROCHESTER, NY - Hover-Davis Inc. has appointed Electri-Rep as its sales representative for Kansas, Missouri, Iowa and Nebraska.
Electri-Rep has provided electronics manufacturing equipment and assembly materials for over 30 years in the territory.
Electri-Rep has provided electronics manufacturing equipment and assembly materials for over 30 years in the territory.
Hover-Davis is a manufacturer of component delivery systems for the electronics assembly industry, providing feeding solutions for Fuji, Panasonic, Universal Instruments, Siemens, Assembleon, Samsung, Mydata, Juki, Yamaha, Alphasem and numerous custom automation manufacturers. The company’s products include electronic multi-pitch tape feeders, label feeders, print-on-demand label feeders, and bare die feeders.
Clinton, NY -- Dr. Ning-Cheng Lee, vice president of technology at Indium Corp., will receive the 2006 Exceptional Technical Achievement Award from the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. Dr. Lee was selected for his contributions to surface-mount technology and electronics packaging assembly.
This annual award recognizes contributions to new and important technology or products that advance the fields encompassed by the CPMT Society. The award presentation will take place on June 1, as part of the Electronics Components and Technology Conference (ECTC) in San Diego.
Dr. Lee was named SMTA Member of Distinction in 2002 and received the Soldertec Global Lead-Free Solder Award in 2003. He is also an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and author of two books and over 100 technical papers.
SAN JOSE -- Flextronics International today agreed to sell a majority stake in its software development business to private-equity firm Kohlberg Kravis for $900 million.
Flextronics expects to receive $600 million in
cash consideration and $250 million in notes with a 10.5%
paid-in-kind interest coupon which matures in eight years.
Flextronics expects to net $175 million after taxes upon closing, which is expected this summer.
Flextronics expects to net $175 million after taxes upon closing, which is expected this summer.
SALT LAKE CITY -- CirTran Corp. reported record sales and narrowed its net loss by 20% for its fiscal year ended Dec. 31.
The contract manufacturer reported a net loss of $527,708 on net sales of $12.99 million, up 46.6% from fiscal 2004. Gross profit rose 243% to $6.3 million.
The contract manufacturer reported a net loss of $527,708 on net sales of $12.99 million, up 46.6% from fiscal 2004. Gross profit rose 243% to $6.3 million.
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