Jersey City, NJ – Cookson Electronics Assembly Materials’ ALPHA Vaculoy SACX lead-free wave solder alloy has been approved for use by LG Electronics DS Division (CD-ROM).
Gerry Campbell, a Cookson global product manager, noted that “As leading OEM companies such as LG continue to drive the reduction in the total cost of their lead-free assemblies, we see a continuation of the trend of customers moving away from SAC305 to SACX.”
Gerry Campbell, a Cookson global product manager, noted that “As leading OEM companies such as LG continue to drive the reduction in the total cost of their lead-free assemblies, we see a continuation of the trend of customers moving away from SAC305 to SACX.”
ANGLETON, TX – Benchmark Electronics, a top EMS firm, expects revenues and earnings per share to exceed the high end of guidance for its fiscal second quarter.
The company in April guided for quarterly revenue of $630 million to $660 million.
The company is finalizing its financial closing for the second quarter ended June 30. Results for the second quarter will be announced July 20.
The company is finalizing its financial closing for the second quarter ended June 30. Results for the second quarter will be announced July 20.
SAN FRANCISCO – Makers of semiconductor production equipment and materials can look forward to the market for their wares growing 19% sequentially this year and 10% next year to reach $40 billion, the highest level since 2000.
The forecast was disclosed this week at the SemiCon West trade show by Strategic Marketing Associates. According to SMA president George Burns, the double-digit growth for this year and next is being fueled by rising levels of new wafer fab construction that began in 2004 and is expected to crest in 2007. “We see the industry bringing 35 new fabs online by end of 2007 with a total equivalent capacity, when fully ramped, of more than 2 million 200mm diameter wafers per month. Representing more than 15 acres of silicon, this monthly output is roughly equal to 18% of industry's theoretical full capacity today.”
The forecast was disclosed this week at the SemiCon West trade show by Strategic Marketing Associates. According to SMA president George Burns, the double-digit growth for this year and next is being fueled by rising levels of new wafer fab construction that began in 2004 and is expected to crest in 2007. “We see the industry bringing 35 new fabs online by end of 2007 with a total equivalent capacity, when fully ramped, of more than 2 million 200mm diameter wafers per month. Representing more than 15 acres of silicon, this monthly output is roughly equal to 18% of industry's theoretical full capacity today.”
LONDON -- The National Physical Laboratory has launched a six-month study into the use of XRF techniques.
NPL said in a press release that 10 companies have already signed on to participate in the project, which will assess XRF as a means for determining the presence and amount of various hazardous substances.
The protocol would include assessing a range of sample configurations incorporating known issues with RoHS-prohibited contaminants. Samples would be chemically analyzed prior to round-robin testing. After testing, the actual samples used will be chemically analyzed again to eliminate batch variance problems. The final report would include a comparison of XRF techniques and test sites.
The project is scheduled to launch this month July and last six months. The work will be presented to the NPL Soldering Science & Technology Club and disseminated in an NPL Report.
For more information contact Dr. Chris Hunt at chris.hunt@npl.co.uk .
NPL said in a press release that 10 companies have already signed on to participate in the project, which will assess XRF as a means for determining the presence and amount of various hazardous substances.
The protocol would include assessing a range of sample configurations incorporating known issues with RoHS-prohibited contaminants. Samples would be chemically analyzed prior to round-robin testing. After testing, the actual samples used will be chemically analyzed again to eliminate batch variance problems. The final report would include a comparison of XRF techniques and test sites.
The project is scheduled to launch this month July and last six months. The work will be presented to the NPL Soldering Science & Technology Club and disseminated in an NPL Report.
For more information contact Dr. Chris Hunt at chris.hunt@npl.co.uk .
SAN FRANCISCO – A group of 34 U.S. attorneys general on Friday filed suit in California District Court against seven computer memory chip manufacturers alleging the firms violated antitrust laws, and harmed consumers and governmental agencies, by conspiring to fix prices they charged for widely used DRAM chips.
The defendants include Infineon Technologies, Hynix Semiconductor, Micron Technology, Mosel Vitelic, Nanya Technology, Elpida Memory and NEC Electronics America. Also named as defendants were certain subsidiaries that sold and distributed DRAM chips in the U.S.
Infineon, Hynix, Micron, along with Samsung, control roughly 70% of the U.S. market.
The defendants include Infineon Technologies, Hynix Semiconductor, Micron Technology, Mosel Vitelic, Nanya Technology, Elpida Memory and NEC Electronics America. Also named as defendants were certain subsidiaries that sold and distributed DRAM chips in the U.S.
Infineon, Hynix, Micron, along with Samsung, control roughly 70% of the U.S. market.
SAN JOSE – A Lockheed Martin engineer has devised a matrix
for gold content and is making the calculator available at no cost. The
nonproprietary Excel spreadsheet allows users to plug in solder and gold
thickness, plus the pad and component attach geometry, and then calculates the
percent-gold, making it simple to determine whether the fillet might encounter
gold-embrittlement problems.
Users could also create their own gold thresholds and color schemes.
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- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri