Circuits Assembly Online Magazine - Features

WASHINGTON -- Total spending on electronics or computer-related equipment, such as home computers, laptops, PDAs, or calculators, is estimated to increase by more than $1.5 billion this year, rebounding to $3.82 billion after a sharp decline in 2005.

SAN JOSE -- The performance potential of high speed, copper based, direct interconnections between IC packages by means of a flexible circuit was validated by Intel Corp. in July at the IEEE CPMT Society's ECTC conference.

A paper, Flex-Circuit Chip-to-Chip Interconnects, was authored by team of scientists and engineers from facilities in Hillsborough, OR, Santa Clara, CA and Chandler, AZ. The authors concluded that “20 Gbps signaling on channels of relevant lengths is possible,” but noted that “we are not ready to introduce flex I/O into any mainstream products.” Even so, they did conclude that “the possibility of a chip-to-chip interconnect with minimal discontinuities and propagation loss is a strong attractor and corresponding high-speed solutions will be in demand.”

“We are delighted with both the quality of the Intel team's research and their reported results” noted SiliconPipe CEO and co-founder Joseph Fjelstad, “These results (20Gbps over extended distance) add significant credibility to SiliconPipe's concepts and validate the results SiliconPipe has presented to the electronics industry over the last few years, most recently in February at DesignCon West.”

SiliconPipe OTT technology (an acronym for Off-the-Top or Over-the-Top) can enable high-speed data requirements and low power potential.

“In our demonstration vehicle, code named Sidewinder, our team showed it possible to send signals at 10 Gbps over distances up to 30 in. through two connectors and do so using less than 2% of the anticipated transmission power while maintaining a 60% timing margin,” Fjelstad said. “However, there is still more benefit to mine and extract in this area and SiliconPipe is continuing to develop and evaluate new copper based interconnection solutions to meet the cost performance needs of future electronics and the Stair Step Package it appears will be an important element of that future.”

SAN JOSE -- The Nasdaq stock exchange has issued a delisting warning to Sanmina-SCI for the EMS firm's failure to file its quarterly 10-Q form.

In response, Sanmina-SCI has requested a hearing before the Nasdaq Listing Qualifications Panel.

Loughborough, England – The U.K. contract electronics group Datalink has acquired MSS/ Manufacturing Support Services, an Arizona contract manufacturer, and its associated electronics assembly company Servicios de Fabricacion based in Nogales, Mexico.

Since the acquisition, the assembly lines have been moved to more appropriate facilities, new surface-mount equipment has been installed, ESD precautions improved and MRP systems updated to manage full turnkey operations and trace ability. RoHS assemblies are now welcomed and ISO 9000 registration is scheduled for first half 2007.

Datalink concentrates on small- to mid-volume, low- to high-mix, through-hole, surface-mount and mixed technology PCB assembly.

VANCOUVER, BC -- Northstar Electronics reported second quarter revenues were down 4.8% to $346,152 versus last year.

For the three months ended June 30, the company incurred a loss of $213,335, up from a loss of $238,743 in 2005. Revenues include government assistance.

Northstar specializes in sonar technology, systems integration and electronics contract manufacturing.