The iron, model CL-3, was built in November 2004 and is identifiable by the markings "6G98," "MODEL CL-3," "E190243" and the UL Listing Mark for the U.S. and Canada.
According to UL, the Taiwanese company shipped 2000 units.
According to UL, the securement of the power supply cord connections does not comply with UL's applicable safety requirements. This poses a risk of electric shock and fire hazard to users.
A picture of this product is at www.ul.com/media/newsrel/nr031706.html.UL recommends that users stop using the product immediately and return it to the place of purchase.
The consumer contact for Shuang Shi is 28, Sheng Wong Chi Hsia, Li Yu Tang Tsun, San Yi Hsiang, Miao-Li Hsien 367, Taiwan.
Siemens will integrate the business with its Electronics Assembly Systems division, which includes its Siplace placement machines.
The companies suggested that they would look at ways to integrate placement and die bonding processes.
Revenues rose 4.4% sequentially, in line with previous company guidance, but fell 28% year-over-year.
http://circuitsassembly.com/blog/
Zarrow is president and co-founder of ITM Consulting, and a Circuits Assembly columnist. He will speak from 8:30-9:30 a.m. on “Implementing Lead-Free: The Other 90%.” He will examine what Pb-free means to the electronic assembler at the process and logistics level. The impact upon printing, placement, reflow and inspection will be examined as well as the adaptations necessary by purchasing, quality assurance and product development groups.
Mike Buetow, Editor-in-Chief of Circuits Assembly, will follow with a presentation entitled, “Who Owns the Supply Chain?” According to Buetow, there is a is a war on in the supply chain as each segment fights for its share of the OEM pie. As EMS and distributors add value-added services, their suppliers cannot help but be impacted. Environmental legislation is affecting how everyone (designers, fabricators, assemblers) does business. The presentation will provide a look at how the supply chain is shaping up and what it might look like in the future.
For information on exhibiting or attending, visit: smta.org/education/vendor_days/vendor_days.cfm#ga
SARATOGA, CA – State of the art wafer fabrication capacity reached a record high of 99% in the fourth quarter of 2005, prompting speculation over a potential recession.
According to research firm Advanced Forecasting Inc., the fourth-quarter utilization level is “reminiscent” of cycles in 1995 and 2000 in which utilization rates of the SoA technology (defined as line widths smaller than 0.12 microns) topped 97%, only to be followed by a recession.
This time it’s different, the semiconductor forecasting house says.
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