KUALA LUMPUR -- Overlooked by the media, but not by investors, Malaysia continues to be a quiet hot spot for foreign investment in electronics manufacturing.
Outside investors poured $4.9 billion into manufacturing facilites in Malaysia last year, the highest mark since 2001, according to the nation's trade ministry. Electrical and electronics products accounts for half the Southeast Asia nation's annual exports.
Outside investors poured $4.9 billion into manufacturing facilites in Malaysia last year, the highest mark since 2001, according to the nation's trade ministry. Electrical and electronics products accounts for half the Southeast Asia nation's annual exports.
MINNEAPOLIS -- CyberOptics reported fourth-quarter sales of $12.1 million, up 17% sequentially and 7.9% year-over-year. For the period ended Dec. 31, net income was $5.2 million, including non-cash income of $3.7 million, up from $626,000 or in the third quarter and $794,000 last year.
Revenue and earnings exceeded company guidance.
Revenue and earnings exceeded company guidance.
Clinton, NY – Assembly materials supplier Indium Corp. offers an Electronics Assembly Reliability Program to meet the performance challenges facing electronics assemblers. The program combines products, service and technologies to optimize finished goods reliability.
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Products featured in the reliability program include:
Indium5.1 Pb-Free, No-Clean Solder Paste -Addresses via-in-pad voiding, CSP printing for SMT Reliability.
Wave Solder Products (WF7742, PIP+ Preforms) -Addresses incomplete barrel fill with Pb-Free alloys for PTH Reliability.
No-Flow Underfills (NF220, NF260) -Addresses joint cracking due to brittle Pb-Free alloys and reduced-size joints for CSP Reliability.
Thermal Interface Materials (solder TIM) -Addresses thermal performance issues caused by increased power and reduced component size for Thermal Reliability.
The program also offers customers new process and application concepts as well as the industry’s largest SMTA-certified engineering staff, an online interactive technology knowledgebase and online Pb-free readiness assessment software.
For more info, visit indium.com/reliability .
Edina, MN --The SMTA is seeking papers for its third annual International Wafer-Level Packaging Conference and Exhibition. The event will take place on Nov. 2-3 in San Jose, CA, and will track IC packaging and test technologies with emphasis on 3-D stacked packaging.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Submit 200-word abstracts by e-mail to Melissa Serres (melissa@smta.org) by April 1.
Dr. Ken Gilleo, ET-Trends LLC, Circuits Assembly columnist and SMTA VP of Technical Programs, and Terry Thompson of Chip Scale Review will co-chair the technical program.
Edina, MN -- The SMTA and Auburn University are organizing a Harsh Environment Electronics Workshop to be held July 19-20 in Indianapolis, IN. The workshop on automotive, space, military and avionics-type harsh environments is soliciting abstracts that provide new, timely information to attendees on the latest developments.
The deadline for abstracts is March 1.
Specific subject areas include,:
· Issues and Opportunities- Automotive Harsh Environment
· Activities in Semiconductor Technology for Harsh Environment Electronics
· Issues with Harsh Vehicle Systems
· Substrate Advancements for Harsh Environment Electronics
· Next Generation Harsh Automotive Systems
· Connectors and Interconnect Technology
· Lead-Free Implementation for Harsh Environment Electronics
· Advancements in Materials for Harsh Environment Electronics
Send a 200-300 word abstract to Melissa Serres (melissa@smta.org), and include: Name, Company, Mailing Address, Telephone Number, Fax Number, E-Mail Address and Presentation Title.
For more info, visit smta.org/education/symposia/symposia.cfm#harsh
Pittsburgh, PA – DesignAdvance Systems, Inc., an electronic design automation (EDA) and computer aided design (CAD) software developer, has completed a $3 million second round of funding.
Randy Eager, CEO, noted that the additional funds will be used to “add the necessary sales, support and marketing staff to hit our sales targets for 2006 and beyond.”
The company has also graduated from The Technology Collaborative Jumpstart program. The economic development organization supports the growth of
Pennsylvania’s digital technologies, robotics and cyber-security industries.
“The resources and infrastructure of The Technology Collaborative gave us many advantages we needed to start and run our business,” continued Eager. “They provided us with initial contacts to potential customers; rent free office space next to Carnegie Mellon University, our technology licensor; and a sounding board for new ideas.”
Randy Eager, CEO, noted that the additional funds will be used to “add the necessary sales, support and marketing staff to hit our sales targets for 2006 and beyond.”
The company has also graduated from The Technology Collaborative Jumpstart program. The economic development organization supports the growth of
Pennsylvania’s digital technologies, robotics and cyber-security industries.
“The resources and infrastructure of The Technology Collaborative gave us many advantages we needed to start and run our business,” continued Eager. “They provided us with initial contacts to potential customers; rent free office space next to Carnegie Mellon University, our technology licensor; and a sounding board for new ideas.”
DesignAdvance has debuted its first product, CircuitSpace, and has strategic partnering agreements with Cadence Design Systems, Mentor Graphics and Valor Computerized Systems.
Press Releases
- Koh Young Honored by Foxconn with 2024 Digital Ecosystem Partner Award
- SIA Applauds Finalization of CHIPS Investments for Intel Manufacturing Projects
- Spectrum Advanced Manufacturing Technologies Named Manufacturing Partner for D-Orbit USA
- Absolute EMS Enters Strategic Partnership with PTEC Solutions to Enhance End-to-End Electronics Manufacturing Capabilities