MILPITAS, CA -- Solectron Corp. has completed a $250
million stock buyback begun in July, and will conduct a similar-sized
stock repurchase program starting in the second quarter of fiscal 2006.
THE WOODLANDS, TX -- Huntsman
Corp., the chemicals maker,
reported a third-quarter net loss of $29.8 million on a 6.4% gain in
revenues, to $3.1 billion, for the quarter ended Sept. 30.
The loss included $600,000 in tax losses from discontinued operations and net of tax charges of $68.4 million for restructuring, impairment and plant closing costs and $41.4 million for the early extinguishment of debt.
The company reported a net income of $43.7 million in the third quarter of 2004, including $2.8 million in tax losses from discontinued operations and net of tax charges of $32.6 million for restructuring, impairment and plant closing costs and a net of tax gain for early extinguishment of debt of $2.3 million.
Sales from its Advanced Materials group, which makes coatings for construction markets and electronics, fell 1.7%, to $289.4 million on lower volumes. Average selling prices rose 10% due to price increase initiatives in certain markets in response to improved demand and higher raw material costs.
Peter R. Huntsman, president and CEO, said, "The third quarter was extremely challenging from an operating perspective. Hurricane Katrina and Hurricane Rita negatively impacted not only our manufacturing facilities in the U.S. Gulf Coast but also the operations of many of our customers and suppliers. These storms also resulted in dramatic increases in feedstock and energy costs in the second half of the quarter.
"In addition, raw material pressures appear to have eased in recent weeks, which together with initiatives to raise our selling prices in our differentiated segments, should provide opportunities to expand profitability as we enter 2006."
The loss included $600,000 in tax losses from discontinued operations and net of tax charges of $68.4 million for restructuring, impairment and plant closing costs and $41.4 million for the early extinguishment of debt.
The company reported a net income of $43.7 million in the third quarter of 2004, including $2.8 million in tax losses from discontinued operations and net of tax charges of $32.6 million for restructuring, impairment and plant closing costs and a net of tax gain for early extinguishment of debt of $2.3 million.
Sales from its Advanced Materials group, which makes coatings for construction markets and electronics, fell 1.7%, to $289.4 million on lower volumes. Average selling prices rose 10% due to price increase initiatives in certain markets in response to improved demand and higher raw material costs.
Peter R. Huntsman, president and CEO, said, "The third quarter was extremely challenging from an operating perspective. Hurricane Katrina and Hurricane Rita negatively impacted not only our manufacturing facilities in the U.S. Gulf Coast but also the operations of many of our customers and suppliers. These storms also resulted in dramatic increases in feedstock and energy costs in the second half of the quarter.
"In addition, raw material pressures appear to have eased in recent weeks, which together with initiatives to raise our selling prices in our differentiated segments, should provide opportunities to expand profitability as we enter 2006."
Washington, DC – Plans are underway for the IMAPS International Conference and Exhibition on Device Packaging, March 20 – 23, 2006, in Scottsdale, AZ.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
The conference is dedicated to the challenges and technologies for packaging and devices of all types. Dr. Andrew Strandjord, IMAPS VP of technology and Device Packaging ’06 general chair, said in a statement, “This Conference will feature a new format – six workshops concentrating on 3-D Packaging; Copper/Low-K; Flip-Chip Technologies; High Frequency/Microwave; MEMS; and Optoelectronics.”
It will also feature an exhibition and technology showcase.
For more info., visit imaps.org/devicepackaging.
MINNEAPOLIS -- The annual Pan Pacific Microelectronics Symposium
& Exhibit will focus on lead-free PWB finishes, 3-D integration,
lead-free package finishes and advanced flip chips.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
The dual keynotes are, Prospects and Challenges of Nano-Packaging for Electronic and Bioelectronic Systems, will be given by Rao Tummala, Ph.D., of the Georgia Institute of Technology, and Summary of New England Lead-free Consortium Implementation Plan of High Volume Assembly of Printed Wiring Boards, by Sammy Shina, Ph.D., of the University of Massachusetts Lowell.
The event takes place Jan. 17-19, in Hawaii and is sponsored by the SMTA.
Other sessions will cover thermo-mechanical reliability, materials deposition, MEMS and sensor networks, and embedded and SiP packaging, materials and process management and reliability testing and failure analysis.
Sponsors include 3M Co., Asymtek, Dow Corning, Indium, Libra Industries and Sonoscan.
For details visit smta.org/pan_pac.
SAN JOSE -- Tessera
Technologies, a fabless chip packaging company, has entered into a definitive agreement to purchase
certain assets of Shellcase Ltd., for
$33 million in cash. The deal is pending standard closing conditions
and regulatory approvals and is expected to close in the December
quarter.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
Shellcase is a provider of commercial wafer-level image sensor packaging. Its technology portfolio includes wafer-level packaging for image sensors and other devices used in cellphones that integrate digital cameras.
"Tessera is one of the world's leading technology development and licensing companies. This, in combination with the Shellcase technology and team, will enable us to grow the new business substantially," said Bruce McWilliams, Tessera's chairman and chief executive officer. "Furthermore, it solidifies our position in the wafer-level packaging market for image sensors and MEMS devices, which we believe to be among the semiconductor industry's fastest growing market segments."
According to Prismark Partners, a research firm, the image sensor market is expected to grow from approximately 520 million units in 2004 to approximately 1.3 billion units by 2009. And In-Stat forecasts the MEMS market to grow from 2.4 billion units in 2004 to nearly 6 billion units by 2009.
HERNDON, VA -- A pair of trade groups will discuss implementation and adoption of material composition data exchange
standards at Productronica this month.
IPC and iNEMI will sponsor the meeting, scheduled for Nov. 16 from 9 to noon.
Press Releases
- Surf-Tech Manufacturing Corp. Ensures World-Class Quality with Advanced Conformal Coating Services
- Luminovo Partners with Sluicebox to Offer an Industry-First Instant Product Carbon Footprint for Electronics
- The Assembly Show and SMTAI Announce Colocation in October
- SIA Applauds CHIPS Act Incentives for GlobalWafers Projects in Texas and Missouri